SOLIDWORKS Flow Simulation Electronic Cooling Module Network Add-On
WHICH SOLIDWORKS FLOW SIMULATION PACKAGE IS RIGHT FOR YOU?
Why Choose SOLIDWORKS Flow Simulation Electronic Cooling Module Network Add-On?
Simulate the fluid flow, heat transfer, and fluid forces that are critical to the success of your designs.
Dedicated thermal management study simulation tools for accurate thermal analysis of electronic Printed Circuit Board (PCB) and enclosure designs.
SOLIDWORKS Flow Simulation Electronic Cooling Module Network Add-On Features
SOLIDWORKS Simulation is fully embedded in SOLIDWORKS 3D CAD for ease of use and data integrity. Using the same user interface (UI) paradigms as SOLIDWORKS with toolbars, menus, and context-sensitive right-click menus, ensures rapid familiarization. Built-in tutorials and searchable online help aid learning and troubleshooting.
Conduct an optimization study for more than one input variable using Design of Experiments and Optimization parametric study. Run a calculation of design points and find optimum solutions.
SOLIDWORKS Flow Simulation: A customizable engineering database enables users to model and include specific solid, fluid, and fan behaviors.
SOLIDWORKS Flow Simulation and HVAC Module: The HVAC engineering database extension adds specific HVAC components.
SOLIDWORKS Flow Simulation and Electric Cooling Module: The Electronic Cooling extended engineering database includes specific electronic components and their thermal characteristics.
Calculate the impact of fluid flow through your product.
Calculate the impact of fluid flow around your product
By default, all calculations are on a full 3D domain. Where applicable, simulations can also be carried out in a 2D plane to reduce run time without effecting accuracy.
The calculation of temperature change in the product’s solid geometry is an option selection. Conjugate heat transfer through convection, conduction, and radiation can be created. Calculations can include thermal contact resistance.
SOLIDWORKS Flow Simulation: Calculate pure heat conduction in solids to identify problems where no fluid exists for fast solutions.
SOLIDWORKS Flow Simulation and HVAC Module: Include materials that are semitransparent to radiation, for accurate solutions where the product’s thermal load is influenced by transparent materials.
SOLIDWORKS Flow Simulation and Electrical Cooling Module: Simulate specific electronics device effects
Include fluid buoyancy important for natural convection, free surface, and mixing problems.
Simulation solution times can be reduced by taking advantage of symmetry.
Cartesian symmetry can be applied to x, y, or z planes.
Sector period icy allows users to calculate a sector of a cylindrical flow.
Laminar, turbulent, and transitional boundary layers are calculated using a modified Law of the Wall approach.
Problems can be defined by velocity, pressure, mass, or volume flow conditions.
Thermal characteristics for fluids and solids can be set locally and global for accurate setup.
Local and global wall thermal and roughness conditions can be set for accurate setup.
Ability to treat some model components as porous media with the fluid flow through them, or simulating them as fluid cavities with a distributed resistance to fluid flow.
Visualize the stress and displacement of your assembly with customizable 3D plots. Animate the response of your assembly under loads to visualize deformations, vibration modes, contact behavior, optimization alternatives, and flow trajectories.
Provides the standard results components for a structural analysis, such as von Mises stresses, displacements, temperature, etc. The intuitive equation-driven result plot enables you to customize the post-processing of structural analysis results for better understanding and interpretation of product behavior.
Create and publish customized reports for communicating simulation results and collaborating with eDrawings®
Ability to calculate (with the post-processor) in the obtained fields of results, motions of the specified particles (Particle Studies) or flows of the specified extraneous fluids (Tracer Study) in the fluid flow, which does not affect this fluid flow.
Printed Circuit Boards